Tuesday, August 19th

Latest Challenges for High Speed SerDes Systems 

Chair/Moderator: Stephen Scearce, Cisco Systems Inc, Apex, NC, USA

Location: AtE Stage
Time: 10:00 AM – 11:30 AM

Abstract: With the latest drive for faster AI training systems, the electronics industry is being pushed to advance at a much faster pace.  These GPU clusters require communication at extremely high data rates with minimal latency. Companies are now shipping 224Gbps SerDes in large volumes and are actively exploring the next generation of 400Gbps per lane systems. As data rates continue to climb, the challenges in signal and power integrity are pushing the limits of what is achievable in PCBs, packages, and cable backplanes. Our panel of experts from the industry and academia will each address a current challenge related to SerDes systems and provide an extended Q&A session to share their extensive experience. 

Planned Panelists:
Todd Westerhoff, Siemens, Maynard, MA, USA
Scott Huss, Cadence, Cary, NC, USA
Quinn Gaumer, Cisco, Durham, NC, USA
Francesco de Paulis, University of L’Aquila, L’Aquila, AQ, Italy
Bhyrav Mutnury, Advanced Micro Devices Inc, Austin, TX, USA
Xiaoning Ye, Intel Corp, Hillsboro, OR, USA

Automotive Hybrid, Electric and Autonomous – Addressing the Complexity of Modern Vehicles

Chair/Moderator: Janet O’Neil, ETS-Lindgren, Cedar Park, TX, USA

Location: AtE Stage
Time: 2:00 PM – 3:30 PM

Abstract: Today’s complex vehicle platforms include propulsion, entertainment and safety related systems all having to function reliably without impacting safety or the legacy communications infrastructure.  The increased interest in autonomous vehicles is also driving the need for more sophisticated automotive EMC design and test scenarios, such as those addressing EMC, sensors (including radar) and wireless considerations.  This impacts both component level and full-vehicle level emissions and immunity. Our Automotive “Ask the Experts” panelists represent a diversity of automotive related organizations, including full vehicle manufacturers, an integrated circuit (IC) test specialist, members of the ISO/CISPR D Automotive EMC Committees, an automotive test chamber and instrumentation manufacturer, and a commercial automotive EMC test lab.  These experts will share their knowledge on current and future automotive EMC design and test considerations.  Bring your questions or simply listen and learn. 

Planned Panelists:
Bob Mitchell, TUV Rheinland AG, Boxborough, MA, USA
Garth D’Abreu, ETS-Lindgren, Cedar Park, TX, USA
Ronald Missier, Ford Motor Company, Northville, MI, USA
Rich Boyer, Aptiv Plc, Warren, OH, USA
Robert Kado, Stellantis US, Auburn Hills, MI, USA
Craig Fanning, Elite Electronic Engineering, Inc., Downers Grove, IL, USA

Thursday, August 21st

Ask a Practitioner: A Panel of EMC Lab Coordinators and Assessors

Chair/Moderator: Jacob Dixon, International Business Machines Corp, Rochester, MN, USA

Location: AtE Stage
Time: 10:00 AM – 11:30 AM

Abstract: When theory becomes practice. This panelist discussion will allow attendees, both new and experienced, to ask direct questions and listen to discussion from leaders in the EMC community from a practitioner point of view. 
The format of the panel will be 8 speakers. Four lab coordinators coming from diverse DUT backgrounds. Four lab assessors/assessor managers; two from NVLAP, and two from A2LA, to give their perspective from a quality assessment point of view. 

Planned Panelists:
David Schaefer, Element Materials Technology, Fridley, MN, USA
Bob Mitchell, TUV Rheinland AG, Boxborough, MA, USA
Daniel Hoolihan, Hoolihan EMC Consulting, Lindstrom, MN, USA
Victor Kuczynski, Vican Corporation, Scarborough, ON, Canada
David Zimmerman, Spectrum EMC, LLC, Sierra Vista, AZ, USA
Megan McConnell, American Association for Laboratory Accreditation, Frederick, MD, USA