Abstract: This is an Open Forum, Q&A Panel Discussion where individuals in the audience can bring their program technical challenges to experts for resolution. It is expected that the audience will primarily be US, Canadian and European Defense contractor (i.e., Lockheed Martin, Raytheon, etc.) EMC Engineers.  In addition to defense contractors, US DoD Civilian and Canadian & European Defense EMC Engineers are expected to be in attendance.

Planned Panelists:
(US Gov’t attendees are uncertain due to travel restrictions)
Finbarr O’Connor, Tri-Service Working Group
Mark Waller, Army
Greg Hiltz, Canadian Defense
Frank Leferink, University of Twente
Mike Stone, Navy
William Kozma, NTIA

Abstract: With the latest drive for faster AI training systems, the electronics industry is being pushed to advance at a much faster pace.  These GPU clusters require communication at extremely high data rates with minimal latency. Companies are now shipping 224Gbps SerDes in large volumes and are actively exploring the next generation of 400Gbps per lane systems. As data rates continue to climb, the challenges in signal and power integrity are pushing the limits of what is achievable in PCBs, packages, and cable backplanes. Our panel of experts from the industry and academia will each address a current challenge related to SerDes systems and provide an extended Q&A session to share their extensive experience. 

Planned Panelists:
Todd Westerhoff,  Siemens 
Ken Willis, Cadence 
Quinn Gaumer, Cisco Systems 
Francesco De Paulis, U. L’Aquila
Xiaoning Ye, Intel

Abstract: Today’s complex vehicle platforms include propulsion, entertainment and safety related systems all having to function reliably without impacting safety or the legacy communications infrastructure.  The increased interest in autonomous vehicles is also driving the need for more sophisticated automotive EMC design and test scenarios, such as those addressing EMC, sensors (including radar) and wireless considerations.  This impacts both component level and full-vehicle level emissions and immunity. Our Automotive “Ask the Experts” panelists represent a diversity of automotive related organizations, including full vehicle manufacturers, an integrated circuit (IC) test specialist, members of the ISO/CISPR D Automotive EMC Committees, an automotive test chamber and instrumentation manufacturer, and a commercial automotive EMC test lab.  These experts will share their knowledge on current and future automotive EMC design and test considerations.  Bring your questions or simply listen and learn. 

Planned Panelists:
Bob Mitchell, TUV Rheinland, Littleton, MA, USA
Garth D’Abreu, ETS-Lindgren, Cedar Park, TX, USA
Ron Missier, Ford Motor Company, Dearborn, MI, USA
Rich Boyer, Aptiv, Warren, OH, USA
Robert Kado, Stellantis, Auburn Hills, MI, USA

Abstract: When theory becomes practice. This panelist discussion will allow attendees, both new and experienced, to ask direct questions and listen to discussion from leaders in the EMC community from a practitioner point of view. 
The format of the panel will be 8 speakers. Four lab coordinators coming from diverse DUT backgrounds. Four lab accessors/accessor managers; two from NVLAP, and two from A2LA, to give their perspective from a quality assessment point of view. 

Planned Panelists:
David Schaefer, Element
Bob Mitchell, TUV Rheinland
Dan Hoolihan, NVLAP
Victor Kuczynski, NVLAP
Dave Zimmerman, A2LA
Megan McConnell, A2LA