Christian Schuster (IEEE Fellow) received a Diploma degree in physics in 1996 and a Ph. D. degree in electrical engineering in 2000. Since 2006 he is a full professor at Hamburg University of Technology (TUHH), Germany. Prior to TUHH he was with the IBM T. J. Watson Research Center, Yorktown Heights, NY. His interests include signal and power integrity of digital systems, multiport measurement and calibration techniques, and development of physics-based as well as data-based modeling, simulation and optimization methods for EMC+SIPI. In the recent past, he has served as an Associate Editor for the IEEE Transactions on EMC as well as an Adjunct Associate Professor at the School of Electrical and Computer Engineering of the Georgia Institute of Technology. Currently, he is serving as President of the NIT Northern School of Technology Management at TUHH.

Francesco de Paulis, University of L’Aquila (IEEE Senior Member) Francesco de Paulis received the M.S. degree in Electrical Engineering in May 2008 from Missouri University of Science and Technology (formerly University of Missouri-Rolla), USA, and the PhD degree in Electrical and Information Engineering in 2012 from the University of L’Aquila, L’Aquila, Italy.

He is currently an Associate Professor at the Electromagnetic Compatibility and Signal Integrity Laboratory, University of L’Aquila, Italy, and an Adjunct Professor at the Missouri University of Science and Technology.

His main research interests are in signal and power integrity, high speed channel design, electromagnetic compatibility, antenna design and measurement techniques, design of electronic devices and systems for space applications.

Jayaprakash Balachandran (JP) is the Technical Director at d-Matrix, where he leads efforts in advanced packaging and system design for next-generation AI inference processing systems. Before joining d-Matrix, he worked at Cisco’s Compute Server Business Unit, contributing to the development of multiple generations of Cisco’s flagship Unified Computing System (UCS) Blade and Rack servers. Additionally, he played a key role in leading the BoW interoperability workgroup within the OCP-ODSA initiative. JP holds a Ph.D. from IMEC in Belgium

Eric Bogatin received his BS in Physics from MIT in 1976 and PhD in Physics from the University of Arizona in 1980. He has been active in the SI field for 40 years and has written 15 books and hundreds of articles in this field. Currently, he teaches SI and Electronics courses for undergraduate and graduate students. He is also a Fellow with Teledyne LeCroy and the technical editor of the Signal Integrity Journal.

Matteo Cocchini received his Laurea in Electronic Engineering in June 2006 from University of L’Aquila, L’Aquila, Italy. He received the Master of Science in Electrical Engineering from Missouri University of Science and Technology, Rolla, MO in May 2008. He is an IBM Master Inventor and a senior engineer, team leader of the IBM Z I/O signal and power integrity engineering team, Poughkeepsie, New York.

Benjamin Dannan is the Founder and Chief Technologist at Signal Edge Solutions. Benjamin Dannan is an experienced signal and power integrity (SI/PI) design consultant developing advanced packaging solutions for high-performance ASICs, chiplets, and complex FPGA designs. He is a Keysight ADS Certified Expert with expert-level proficiency in high-speed simulation solutions and multiple 3D EM solutions. He has expert-level proficiency with multiple test and measurement solutions, including oscilloscopes, vector network analyzers (VNA), Time Domain Reflectometers (TDRs), function generators, and EMC lab testing equipment.

John Golding is a Senior Applications Engineer Consultant with Siemens EDA.  He has been working with engineers in several industries for over 10 years to solve their Signal and Power Integrity analysis challenges.  Prior to his current role, he was a hardware engineer for 18 years where he responsible for the design, analysis, and verification of high-speed communications products.  He holds a BSEE degree from the University of Michigan and a MSEE degree from Illinois Tech.

Brandon T. Gore is presently a Principal Technologist at Samtec managing both the Signal Integrity R&D and Electronic Industry Standards teams. His research focuses are advanced interconnect materials, glass packaging, direct drive optics, and general signal integrity bottlenecks for beyond 200Gbps data rates. He is an active contributor to both IEEE 802.3 and OIF Common Electrical I/O projects. Brandon received the PhD degree in electrical engineering from the University of South Carolina under Dr. Paul G. Huray.

Stefano Grivet-Talocia (Fellow, IEEE) is currently a Full Professor of Electrical Engineering with the Politecnico di Torino, Italy. He authored more than 200 international refereed publications in the field of passive macromodeling of lumped and distributed interconnect structures for Signal/Power Integrity, model order reduction, modeling and simulation of fields, circuits, and their interaction. He is part of the top 2% worldwide researcher catalog (Stanford) since 2019. He currently serves as AE for the IEEE Trans. CPMT. He was co-founder (2007) and President of the academic Spin-off IdemWorks, until acquisition by CST in 2016.

Chulsoon Hwang is an Associate Professor at Missouri S&T. Before joining Missouri S&T in 2015, he worked at Samsung Electronics. His research focuses on signal/power integrity, RF/digital integration (RF desensitization), and machine learning-driven hardware design. He has authored or co-authored over 150 papers and has been a co-recipient of more than 10 Best Paper and Best Student Paper Awards at conferences such as IEEE EMC+SIPI, AP-EMC, and DesignCon.

Prof. Roni Khazaka received his Bachelor, Master, and Ph.D. degrees in Electrical Engineering from Carleton University, Ottawa, Canada in 1995, 1998, and 2002, respectively. In 2002, he joined the Department of Electrical and Computer Engineering at McGill University, Montreal, QC, Canada, where he currently is an Associate Professor in the department of Electrical and Computer Engineering, and Associate Dean, Academic Program, in the Faculty of Engineering. Prof. Khazaka is a senior member of the IEEE. In 2009, he was a Visiting Research Fellow with the University of Shizuoka, Shizuoka, Japan. In 2017, he was a Visiting Researcher with the Politecnico di Torino, Turin, Italy. He has authored over 100 journal and conference articles in the areas of signal and power integrity, model order reduction, macromodeling and high frequency circuit simulations. His current research interests include signal and power integrity, electronic design automation, numerical algorithms and techniques, the analysis and simulation of RF ICs, and high-speed interconnects and packages.

Bhyrav Mutnury is a Senior Fellow at AMD, part of Technology and Engineering division where he is responsible for designing next generation high-speed interfaces. Prior to this, Dr. Mutnury was a Senior Distinguished Engineer and Global Team Leader of Signal Integrity group at Dell Technologies. Dr. Mutnury has co-advised 5 PhD students and currently co-advising 2 PhD students. He received his Doctor of Philosophy degree in Electrical Engineering in 2005 from the Georgia Institute of Technology, Atlanta, GA. Dr. Mutnury has authored more than 100 publications in various conferences and journals. Dr. Mutnury has 250 issued patents and another 50 in the pipeline. He is currently an IEEE Fellow and the recipient of IEEE Technical Achievement Award.

Stephen Scearce is a Hardware Engineering Director of Cisco’s COE Electronics Packaging and Diagnostics team.  Stephen provides the technical direction/leadership for Signal Integrity, Power Integrity, Mechanical/Thermal Design, ECAD, and Software Diagnostics design in US/China.  Stephen has worked for Cisco for 23 years focused on ASIC/System PI, SI, Package Design, and EMC design.  He holds 12 issued patents and has co-authored 17 papers.   He has volunteered for the IEEE Electromagnetic Compatibility Society for the past 10 years, and is currently serving as the Society Treasurer, and the 2022-2024 EMC+SIPI Symposium treasurer. Stephen received his BSET and MSEE from Old Dominion University, Norfolk VA.

Madhavan Swaminathan is the Department Head of Electrical Engineering and is the William E. Leonhard Endowed Chair at Penn State University. He also serves as the Director for the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), an SRC JUMP 2.0 Center www.chimes.psu.edu.

Prior to joining Penn State, he was the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC), Georgia Tech (GT). Prior to GT, he was with IBM working on packaging for supercomputers.

He received his MS and PhD degrees in Electrical Engineering from Syracuse University, USA.

Hanfeng Wang received the B.S. and M.S. degrees in electronic engineering from Tsinghua University, Beijing, China, in 2005 and 2008, respectively, and the Ph.D degree in electrical engineering from Missouri University of Science and Technology (formerly University of Missouri-Rolla), Rolla, USA, in 2012. From 2012 to 2015, he was a Signal Integrity Engineer with Apple. From June 2015 to July 2017, he joined Microsoft as a Senior Electrical Engineer and since July 2017, he has been the Signal Integrity Engineer and team lead in Google’s Pixel phone division. His current research interests include signal integrity, power integrity, and electromagnetic interference in high-speed digital systems. He is an active Senior member of IEEE and was the chair for TC10 (focusing on signal and power integrity) of the IEEE EMC Society.