Achieving power integrity (PI) across PCB, package, and silicon for complex, multi-domain systems remains a major challenge, often relying on iterative design and expert experience despite mature post-layout tools. Modern PI demands—such as sub-milliohm impedance targets and space-constrained layouts—exceed the capabilities of traditional methodologies. Recently, AI/ML techniques have emerged as promising solutions for pre-layout PI design and decoupling capacitor optimization, offering the potential to reduce design cycles and enable advanced EDA tools. This special session will address AI/ML algorithms in PI design, which may contribute to new ideas and solutions to the above challenges.

Over the last 10 years the IEC has updated the understanding of HEMP through a series of standards, which have been tailored to the protection of commercial facilities and equipment. The main improvements that have been made recently are to make the standards even more applicable for commercial rather than military purposes. One of the major changes is to avoid relying only on worst-case electromagnetic fields, but rather to show the variability of the HEMP fields in the IEC standards, which generally result in lower levels of the electromagnetic environments, and consequently on more modest protection techniques, such as those found in typical EMC applications. It is noted that individuals with more than 40 years of experience have been invited to describe recent advancements in the HEMP environments. Also, those active in the work of the IEC have been invited to discuss important aspects of protection for commercial applications.

Over the last 10 years the IEC has updated the understanding of HEMP through a series of standards, which have been tailored to the protection of commercial facilities and equipment. The main improvements that have been made recently are to make the standards even more applicable for commercial rather than military purposes. One of the major changes is to avoid relying only on worst-case electromagnetic fields, but rather to show the variability of the HEMP fields in the IEC standards, which generally result in lower levels of the electromagnetic environments, and consequently on more modest protection techniques, such as those found in typical EMC applications. It is noted that individuals with more than 40 years of experience have been invited to describe recent advancements in the HEMP environments. Also, those active in the work of the IEC have been invited to discuss important aspects of protection for commercial applications.