Technical Paper Sessions
The EMC+SIPI 2025 Symposium Committee is excited to share the lineup of Technical Paper Sessions scheduled for the Symposium! These sessions will take place on Tuesday, Wednesday, and Thursday, with each session’s papers featured in the upcoming Advance Program—stay tuned!
Tuesday, August 19, 2025
(POST) Poster Session
Co-Chair: Samuel Connor, International Business Machines Corp
.
Co-Chair: Jacob Dixon, International Business Machines Corp
.
Location: Poster Area
Time: 10:00 AM – 12:00 PM
(SC3_1) Machine Learning Based Methods for EMC and SIPI
Sponsored by SC-3
Chair: Lijun Jiang, Missouri University of Science and Technology
Co-Chair: Alistair Duffy, De Montfort University
Location: 303
Time: 10:30 AM – 12:00 PM
(TC4) Analysis of EMI Coupling Mechanisms
Sponsored by TC-4
Chair: Daryl Beetner, Missouri University of Science and Technology
Co-Chair: Lirim Koraqi, Katholieke Universiteit Leuven
Location: 305B
Time: 10:30 AM – 12:00 PM
(TC6) Spectrum Engineering
Sponsored by TC-6
Co-Chair: Sarah Seguin, The Aerospace Corporation Chantilly
Co-Chair: Larry Cohen, US Naval Research Laboratory
Location: 306A
Time: 10:30 AM – 11:30 AM
(TC10_6) Applications of AI and Optimization Algorithms
Sponsored by TC-10
Chair: Alan Wang, ASML
Co-Chair: Ken Willis
Location: 306B
Time: 10:30 AM – 12:00 PM
(TC10_7) Filter Design for High Frequency Channels
Sponsored by TC-10
Chair: Victor Khilkevich, Missouri University of Science and Technology
Co-Chair: Giorgi Maghlakelidze, NVIDIA Corp
Location: 306C
Time: 10:30 AM – 11:30 AM
(SC3_2) Machine Learning Based Methods for EMC and SIPI
Sponsored by SC-3
Chair: Matteo Cocchini, International Business Machines Corp.
Co-Chair: Ling Zhang, Zhejiang University
Co-Chair: Hanzhi Ma, Zhejiang University
Location: 303
Time: 1:30 PM – 5:00 PM
(TC4_TC8) EMI Control: Shielding, Analysis, and Measurement
Sponsored by TC-4
Co-Chair: Huadong Li, Molex LLC
Co-Chair: John Kraemer, Kraemer EMC
Location: 305B
Time: 1:30 PM – 5:00 PM
(TC2_1) EMC Measurements: Medical and Probes
Sponsored by TC-2
Chair: Monrad Monsen, Oracle America Inc
.
Co-Chair: Ahalya Srikanth, Ford Motor Company
Location: 306A
Time: 1:30 PM – 5:00 PM
(TC10_1) High-Speed Interconnects #1
Sponsored by TC-10
Chair: Hanfeng Wang, Google Inc
.
Co-Chair: Kinger Cai, Arm Ltd
.
Location: 306B
Time: 1:30 PM – 5:00 PM
(TC9_1) Advances in Electromagnetic Modeling and Prediction
Sponsored by TC-9
Chair: Shengxuan Xia, Missouri University of Science and Technology
Co-Chair: Wei Zhang, Marvell Semiconductor Inc.
Location: 306C
Time: 1:30 PM – 4:30 PM
Wednesday, August 20, 2025
(TC5_SC1) Evaluation of EM Interference
Sponsored by TC-5
Co-Chair: Michael McInerney, Consultant
Co-Chair: William Radasky, Metatech Corporation
Location: 305B
Time: 8:30 AM – 10:00 AM
(TC2_2) EMC Measurements: Emissions
Sponsored by TC-2
Chair: Dave Arnett, Garmin International Inc
.
Co-Chair: Monrad Monsen, Oracle America Inc
.
Location: 306A
Time: 8:30 AM – 11:30 AM
(TC10_2) High-Speed Interconnects #2
Sponsored by TC-10
Chair: Daniel Commerou, Missouri University of Science and Technology
Co-Chair: Yifan Ding, Google LLC
Location: 306B
Time: 8:30 AM – 12:00 PM
(TC9_2) EMC Challenges in Complex Systems and Reverberant Environments
Sponsored by TC-9
Chair: Shaohui Yong, Missouri University of Science and Technology
Co-Chair: Patrick DeRoy, Analog Devices Inc
.
Location: 306C
Time: 8:30 AM – 12:00 PM
(TC12) Wireless EMC Advances: RFI Mitigation, Immunity, and Coexistence Testing
Sponsored by TC-12
Chair: Harry Skinner, Intel Corporation
Co-Chair: Gang Feng, Christie Digital Systems Canada Inc
.
Co-Chair: Mingchang Wang, Luxshare Technologies
Location: 303
Time: 9:30 AM – 12:00 PM
(TC5_1) HEMP Test Methods
Sponsored by TC-5
Co-Chair: William Radasky, Metatech Corporation
Co-Chair: Michael McInerney, Consultant
Location: 305B
Time: 10:30 AM – 12:00 PM
Thursday, August 21, 2025
(TC7_1) EMC of Electrical Systems
Sponsored by TC-7
Chair: Flavia Grassi, Politecnico di Milano
Chair: Cong Li, GE Global Research
Chair: Shuo Wang, University of Florida
Location: 305B
Time: 8:30 AM – 11:30 AM
(TC2_3) EMC Measurements: Design Related
Sponsored by TC-2
Chair: John Kraemer, Kraemer EMC
Co-Chair: Monrad Monsen, Oracle America Inc
.
Location: 306A
Time: 8:30 AM – 12:00 PM
(TC10_3) High-Speed Interconnects and Noise Coupling
Sponsored by TC-10
Chair: Wei Zhang, Marvell Semiconductor Inc.
Co-Chair: Chaofeng Li, Qualcomm Inc
.
Location: 306B
Time: 8:30 AM – 12:00 PM
(TC9_3) Electromagnetic Effects in Power Systems and Medical Devices
Sponsored by TC-9
Chair: Scott Piper, Dassault Systemes Americas Corp.
Co-Chair: Shubhankar Marathe, Amazon
Location: 306C
Time: 8:30 AM – 12:00 PM
(TC5_2) HEMP and ESD Design and Modeling
Sponsored by TC-5
Co-Chair: Michael McInerney, Consultant
Co-Chair: William Radasky, Metatech Corporation
Location: 305A
Time: 1:30 PM – 4:00 PM
(TC7_2) Power Electronics EMC
Sponsored by TC-7
Chair: Flavia Grassi, Politecnico di Milano
Chair: Niek Moonen, Universiteit Twente
Chair: Cong Li, GE Global Research
Chair: Shuo Wang, University of Florida
Location: 305B
Time: 1:30 PM – 4:30 PM
(TC2_4) EMC Measurements: Immunity and Shielding
Sponsored by TC-2
Chair: Ahalya Srikanth, Ford Motor Company
Co-Chair: Monrad Monsen, Oracle America Inc
.
Location: 306A
Time: 1:30 PM – 4:00 PM
(TC10_4) Power Distribution Networks and Decoupling
Sponsored by TC-10
Chair: Tao Wang, DIS Tech
Co-Chair: Ji Zhang
Location: 306B
Time: 1:30 PM – 4:30 PM
(TC10_5) Simulation and Modeling Techniques
Sponsored by TC-10
Chair: Baolong Li, Cadence Design Systems Inc
.
Co-Chair: Zhenggang Cheng, Ampere Computing
Location: 306C
Time: 1:30 PM – 4:30 PM
(TC11) Nanotechnology and Advanced Materials
Sponsored by TC-11
Chair: Marina Koledintseva, The Boeing Company, Saint Louis, MO
Location: 306A
Time: 4:30 PM – 5:00 PM
